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Molded-On DIP, .100" x .300" and .100" x .600" | 3M™ Interconnect Solutions

3M Molded-On DIP, .100"; x .300" and .100" x .600"

The 3M Molded-On DIP mates with industry standard IC sockets .100" x .300" up to 28 positions and .100" x .600" between 24 and 40 positions.

Features & Benefits:

  • One of the lowest profiles available in the industry
  • Molded-on solder stand-offs facilitate flux removal
  • Gold or matte tin plating options
  • One-piece, molded-on construction with integral strain relief
  • Closed-end construction
  • Modular tooling allows customized designs

Applications:

  • Network and Telecommunications Equipment
  • Test & Measurement Equipment
  • Data Processing Equipment
  • Printers and Other Computer Peripherals
  • High Vibration
  • Medical Monitors, MRIs, and Other Specialized Equipment

Additional Information: