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• XCede® | FCI

FCI’s XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. The use of engineering polymers in a resonance-damping shield enables very low crosstalk across a wide frequency range.

XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82.4 differential pairs/inch. A wafer organizer can be used to combine groups of right-angle signal, guidance and power modules as an integrated daughter-card connector.

Features & Benefits:

• High-speed backplane system capable of 25 Gb/s
• Use of engineering materials in the shield aids in reduction of crosstalk resonances
• 1.85 mm column pitch offers high linear signal density
  • Configurations with 6 differential pairs/column fit 36 mm card slot pitch and provide 82.4 pairs/inch
  • 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch
  • 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch
• Two ground vias between differential pairs allow elongated antipads to further improve impedance
• Optional short compliant pin permits deeper backdrilling and dual diameter vias to enhance return loss performance
• Wide ground contacts feature a stiffening rib and are advanced well ahead of signals for exceptional robustness and signal pin protection
• Intermateable, electrically and mechanically interchangeable
• Licensed second source to Amphenol TCS

Applications:

• Communications
  • Routers
  • Switches
  • Networking
  • Access
  • Transport
  • Wireless
• Data
  • Servers
  • Storage Systems
• Industrial
• Medical
• Test & Measurement

Additional Information:

• Datasheet (PDF)