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X7R Dielectric Power Automotive SMD Multilayer Ceramic Capacitor | Kemet

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X7R Dielectric Power Automotive SMD MLCC | Kemet

KEMET Power Solutions (KPS) Automotive Series stacked capacitors utilize a proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors into a single compact surface mount package. The attached lead-frame mechanically isolates the capacitor/s from the printed circuit board, therefore offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. A two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Providing up to 10mm of board flex capability, KPS Series capacitors are environmentally friendly and in compliance with RoHS legislation. Available in X7R dielectric, these devices are capable of Pb-Free reflow profiles and provide lower ESR, ESL and higher ripple current capability when compared to other dielectric solutions.

Combined with the stability of an X7R dielectric, KEMET’s KPS Series devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from -55°C to +125°C.

KPS Series automotive grade capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements and are manufactured in state of the art ISO/TS 16949:2002 certified facilities.

Features & Benefits:

  • AEC-Q200 automotive qualified
  • -55°C to +125°C operating temperature range
  • Reliable and robust termination system
  • EIA 1210, 1812 and 2220 Case sizes
  • DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 250V
  • Capacitance offerings ranging from 0.1μF up to 47μF
  • Available capacitance tolerances of ±10% & ±20%
  • Higher capacitance in the same footprint
  • Potential board space savings
  • Advanced protection against thermal and mechanical stress
  • Provides up to 10mm of board flex capability
  • Reduces audible, microphonic noise
  • Extremely low ESR and ESL
  • Pb-Free and RoHS compliant
  • Capable of Pb-Free reflow profiles
  • Non-polar device, minimizing installation concerns
  • Tantalum and electrolytic alternative

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