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Thick and Thin Film Resistor Networks and Arrays: Global Markets 2004-2008
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Product Code: RNETS04
This study addresses the global market for thick and thin film resistor networks and multichip arrays. The study focuses on demand by type, with emphasis upon dual-in-line package (DIP), single-in-line package (SIP), multichip array, and thin film integrated passive devices. Packaging issues are addressed (molded chip versus BGA) as is demand by circuit configuration (bussed, isolated, R2R Ladder networks and RC networks). Trends are given in demand in the array segment with respect to quads and octets, as well as castellated designs. Global value and volume of consumption by world region and end-use market segment is addressed as is the competitive environment (thick film versus thin film); and forecasts to 2008.