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VHDM® H-Series Backplane Connector | Molex

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VVHDM® H-Series Backplane Connector | Molex

The Very High Density Metric 'H' Series (VHDM® H-Series) connector system is designed for applications that require very high interconnect density and high-speed signal integrity. VHDM H-Series enables an installed base to perform at 6.25 Gbps, enabling system upgrades without costly architecture redesigns. With an identical mating interface and envelope, the VHDM H-Series is fully backwards compatible with existing VHDM slots. Designers can use VHDM H-Series to extend the life of existing platforms, reduce development costs and speed higher performance systems to market.

The signal portion of the VHDM H-Series connector system consists of modules in increments of 10 columns or 25 columns in either 6 rows or 8 rows. The daughter card connector consists of a metal stiffener that combines signal wafers, power modules and guidance modules to make one continuous connector that can be ordered with one custom part number. The maximum length of a single stiffener is 300mm (~12 inches). The power contacts can handle 10.0A of current per blade, efficiently delivering up to 120.0A per 25.00mm (.984") of board edge with multiple mating levels for hot plug applications. Metal guide pins and key slots provide excellent guidance for large PCBs and eliminate the possibility of plugging a daughter card into the wrong slot.

Features & Benefits:

  • Data rates up to 6.25 Gbps
  • Mates with existing VHDM systems to enable backwards compatibility with existing VHDM slots
  • Ability to combine VHDM® L-Series (1 Gbps), VHDM® (3.125 Gbps), VHDM® H-Series (6.25 Gbps) and VHDM-HSD™ (5Gbps) wafers on the same metal stiffener
  • Small compliant-pin 0.45mm (.018") PCB hole size
  • Modular construction
  • Enable system upgrade scalability without costly architecture
  • Extends the life of existing platforms, reduces development costs and provides a high system speed to the market
  • Reduces application costs while improving design flexibility
  • Control impedance and minimize cross talk
  • Improves PCB routing and back drilling while reducing impedance discontinuities
  • Maximizes design flexibility via custom configuration of signal, power and guide modules

Applications:

  • Computer Servers/Storage
  • Test Equipment
  • Networking Equipment/Storage Systems
  • Telecommunications