Heatsink with clips for TO-264 and TO-247 (M Series) | Ohmite
Ohmite introduces the M series, patented (Pat. No. 7,151,669), high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.
Features & Benefits:
- Minimum assembly cost and labor. Spring Clips make the mounting holes and fasteners obsolete in assembly operations & reduce costs.
Maximum Thermal Transfer. Maximum surface area per unit volume, efficient cooling fins & consistent mounting force reduces thermal resistance
Maximum Repeatability. Constant spring force over repeated assembly/disassembly
Maximum Reliability. Resilient spring action locks electronic component in place. Fewer parts in assembly and no fasteners and washers required. Prevent short circuit by eliminating metal particles
generated from hardware or thread tapping
Design Flexibility. Maximum flexibility for dynamic device locations and power up grading. “Configureto-Fit” & “Scale-to-Meet” options give designers the total freedom to configure the heat sink to fit their packaging designs and to scale the heat sink to meet their power dissipations.