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BeO Free Packaging Technology | Semelab/TT-Electronics

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BeO Free Packaging Technology | SemelabSemelab RF MOSFETs are manufactured using a unique silicon Vertical DMOS process with gold metalisation which gives high performance and maximum reliability at high power levels.

Features & Benefits:

  • BeO free
  • Lower Thermal Impedance
  • Lower Source inductance
  • Higher Gain


  • Military/Aerospace
  • Industrial Down-Hole

Additional Information: