1.56 Centerline Product Family Overview | TE Connectivity

The miniature AMP-IN Terminal is designed not as an electrical terminal but as a mechanical holding device to enhance soldering of hookup wires to printed circuit boards. The combination of terminal and application tooling eliminates costly manual preparation of wires prior to soldering, and positions the wire to achieve reliable solder joints. Movement of the wire during soldering is restricted, assuring proper solder flow. ( Check TTI Inventory )

The .031 x .062 [0.79 x 1.57] interconnection system has served as an industry standard for modular packaging for over three decades. It is a rugged, large scale system designed for board-to-board and board-to-wire or cable applications that has offered millions of reliable interconnections and countless mating cycles. This versatile interconnection system successfully meets the requirements for most modular power supply packaging. ( Check TTI Inventory )

Mass termination of wire provides the lowest applied cost because it drastically reduces the labor content of virtually any cable or harness assembly required. The MTA-156 IDC connector system is a wire-to-board and wire-to-wire system with contacts in a single row on .156 [3.96] centerline. The design features wire feed-through capability for daisy-chain applications. Insulation displacement contacts are used to terminate a wide range of conductor sizes. Ribbon cable can also be terminated when the appropriate receptacle assembly and strain relief cover are used. Header assemblies for board mount applications include right-angle and vertical mount products available in through-hole and surface mount configurations. ( Check TTI Inventory )

The SL-156 connector system is a wire-to-board system with contacts in a single row on .156 [3.96] centerline. It is designed for proper loading of contacts and has a contact retention feature to prevent back-out. SL-156 housings also mate with MTA-156 right angle and vertical mount headers. ( Check TTI Inventory )