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High Speed Board-to-Board Connectors Product Family | TE Connectivity

tyco_z-dok_plus_sm.jpgAMP Z-DOK Connectors | TE Connectivity
The CHAMP Z-DOK Connector system includes two options for system designers. This high speed connector is suitable for use in co-planar docking applications.
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Tyco-Electronics-Impact-Backplane-Connector-System-sm.jpgIMPACT™ Backplane Connector System | TE Connectivity
TE Connectivity's new high density IMPACT backplane connector system is now available in two, three and four pair. The new Impact backplane connector system is designed for increased speed and density.
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MICTOR-Matched-Impedance-Connectors-Tyco-Electronics.jpgMICTOR Connectors (Matched Impedance Connector) | TE Connectivity
The MICTOR connector family is based on the microstrip concept of two rows of signal contacts divided by a center power ground plane. MICTOR connectors are motherboard and daughtercard compatible and include designs for cable-to-board applications.
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Z-PACK_2mm_HM_sm.jpgZ-PACK 2mm Hard Metric (HM) Contacts and Accessories | TE Connectivity
The AMP Z-PACK 2mm HM Hard Metric connector system is designed to meet the current and future needs of telecommunication, computer and instrumentation applications giving excellent electrical and mechanical characteristics at an economical price. It is a high performance, high density system with flexible configuration which offers upgrade-ability. The connector system is fully supported by TE Connectivity spice models to guarantee choosing the right product to match the application.
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Z-PACK-HS3-Connectors_sm.jpgZ-PACK 2mm HM (Hard Metric) PCB Connectors | TE Connectivity
The AMP Z-PACK 2mm HM Hard Metric connector system is designed to meet the current and future needs of telecommunication, computer and instrumentation applications giving excellent electrical and mechanical characteristics at an economical price. It is a high performance, high density system with flexible configuration which offers upgrade-ability. The connector system is fully supported by TE Connectivity spice models to guarantee choosing the right product to match the application.
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zpack-TE-sm.jpgZ-PACK HM-Zd Plus Connectors | TE Connectivity
The Z-PACK HM-Zd Plus connector offers an increase in data rate performance to 15 - 20 Gb/s enabling a performance upgrade to reduce pcb footprint crosstalk, a tighter impedance control, a reduction of intra pair skew and an improvement in the insertion loss characteristics.
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Z-PACK-Slim-UHD_Connectors_sm.jpgZ-PACK Slim UHD Connectors | TE Connectivity
Z-PACK Slim UHD connector system is a flexible and upgradeable system designed to fit 15 mm (0.6 inch) slot pitch applications and above. The Z-PACK Slim UHD connector has an extremely high contact density combined with excellent high speed signal performance.
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z_pack_sl_thumb.jpgZ-PACK Stripline Connectors SL 100 | TE Connectivity
Z-PACK Stripline 100 connectors have an integral ground plane between each column of contacts to provide the controlled impedance that makes them ideal for high performance systems with edge speeds as fast as 250 picoseconds. Four rows of 0.38 [.015] square posts on 2.54 x 2.54 [.100 x .100] centerlines provide 40 high speed signal lines per inch. No signal lines have to be assigned as ground reference, enabling the connectors to maximize the number of signal lines per unit area.
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tyco_z-pack_tinman_sm.jpgZ-PACK TinMan High Density Backplane Connectors | TE Connectivity
TE Connectivity’s new Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.
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