Two-Piece, High Speed Connectors Product Family Overview | TE Connectivity

Current requirements for the packaging of components in electronic equipment dictate that high-speed (high frequency) signals be transmitted in high quality and increased density and high pin count connections applied to meet the need for higher integration of active devices. AMP Z-PACK* J Series Interconnection System solves all these problems and allows high density packaging while keeping applied cost low, thus contributing to a substantial reduction of overall costs. ( Check TTI Inventory )

AMP Micro-Strip connectors are a high density, controlled impedance connector family compatible with the requirements of high density and high speed data transmission technologies. Each signal line within the mated connector is located at a specific distance from an integral, separable bus bar serving as a ground plane in a micro-strip configuration. The selection of housing dielectric, spacing from signal contact-to-ground plane and conductor geometry provide a specific characteristic impedance plus very low inductance and capacitance. ( Check TTI Inventory )

The AMP Z-PACK 2mm HM Hard Metric connector system is designed to meet the current and future needs of telecommunication, computer and instrumentation applications giving excellent electrical and mechanical characteristics at an economical price. It is a high performance, high density system with flexible configuration which offers upgrade-ability. The connector system is fully supported by TE Connectivity spice models to guarantee choosing the right product to match the application. ( Check TTI Inventory )

High speed differential connectors that are capable of supporting data rates of 10+ Gb/s. The connectors are compatible with the Z-PACK 2mm HM connector line. 80 high speed signals per 25mm board edge. ( more info )

Z-PACK HS3 2.5mm Connectors are very high density, two-piece interconnection for applications requiring gigabit data rates, including servers, mass storage, and networking equipment. These connectors are optimized for high speed serial applications. Z-PACK HS3 Connectors support up to 4.8 Gb/s per differential pair, yielding an aggregate of 240 Gb/s per linear card edge inch (25mm). The 6- or 10-row configurations for 60 or 100 high-speed lines per 25mm are compatible with Z-PACK 2mm HM standard and special option modules, providing flexibility on the card edge. ( Check TTI Inventory )

Z-PACK Stripline 100 connectors have an integral ground plane between each column of contacts to provide the controlled impedance that makes them ideal for high performance systems with edge speeds as fast as 250 picoseconds. Four rows of 0.38 [.015] square posts on 2.54 x 2.54 [.100 x .100] centerlines provide 40 high speed signal lines per inch. No signal lines have to be assigned as ground reference, enabling the connectors to maximize the number of signal lines per unit area. ( Check TTI Inventory )

TE Connectivity’s new Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system. ( more info )