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Two-Piece, High Speed Connectors Product Family Overview | TE Connectivity

AMP-Z-PACK-J-Series_sm.jpgAMP Z-PACK J Series Interconnect System | TE Connectivity
Current requirements for the packaging of components in electronic equipment dictate that high-speed (high frequency) signals be transmitted in high quality and increased density and high pin count connections applied to meet the need for higher integration of active devices. AMP Z-PACK* J Series Interconnection System solves all these problems and allows high density packaging while keeping applied cost low, thus contributing to a substantial reduction of overall costs.
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Tyco-Electronics-Impact-Backplane-Connector-System-sm.jpgIMPACT™ Backplane Connector System | TE Connectivity
TE Connectivity's new high density IMPACT backplane connector system is now available in two, three and four pair. The new Impact backplane connector system is designed for increased speed and density.
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micro-strip_connectors.jpgMicro-Strip Connectors | TE Connectivity
AMP Micro-Strip connectors are a high density, controlled impedance connector family compatible with the requirements of high density and high speed data transmission technologies. Each signal line within the mated connector is located at a specific distance from an integral, separable bus bar serving as a ground plane in a micro-strip configuration. The selection of housing dielectric, spacing from signal contact-to-ground plane and conductor geometry provide a specific characteristic impedance plus very low inductance and capacitance.
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STRADA_Whisper_Connector_sm.jpgSTRADA Whisper Connectors | TE Connectivity
The STRADA Whisper connector is the first of the next generation of high speed backplane interconnects offered by TE Connectivity with an industry leading data rate of up to 40 Gb/s. A revolutionary performance upgrade is a result of the extremely low noise characteristics of the individually shielded pairs which provides improved signal integrity and EMI performance over competitive products. The in-row "horizontal" pair orientation enables the STRADA Whisper to have zero skew.
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Z-PACK_2mm_HM_sm.jpgZ-PACK 2mm Hard Metric (HM) Contacts and Accessories | TE Connectivity
The AMP Z-PACK 2mm HM Hard Metric connector system is designed to meet the current and future needs of telecommunication, computer and instrumentation applications giving excellent electrical and mechanical characteristics at an economical price. It is a high performance, high density system with flexible configuration which offers upgrade-ability. The connector system is fully supported by TE Connectivity spice models to guarantee choosing the right product to match the application.
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Z-PACK-HS3-Connectors_sm.jpgZ-PACK 2mm HM (Hard Metric) PCB Connectors | TE Connectivity
The AMP Z-PACK 2mm HM Hard Metric connector system is designed to meet the current and future needs of telecommunication, computer and instrumentation applications giving excellent electrical and mechanical characteristics at an economical price. It is a high performance, high density system with flexible configuration which offers upgrade-ability. The connector system is fully supported by TE Connectivity spice models to guarantee choosing the right product to match the application.
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tycozpack_HM_sm.jpgZ-PACK HM-Zd Connectors | TE Connectivity
High speed differential connectors that are capable of supporting data rates of 10+ Gb/s. The connectors are compatible with the Z-PACK 2mm HM connector line. 80 high speed signals per 25mm board edge.
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zpack-TE-sm.jpgZ-PACK HM-Zd Plus Connectors | TE Connectivity
The Z-PACK HM-Zd Plus connector offers an increase in data rate performance to 15 - 20 Gb/s enabling a performance upgrade to reduce pcb footprint crosstalk, a tighter impedance control, a reduction of intra pair skew and an improvement in the insertion loss characteristics.
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Z-PACK-HS3-Connectors_sm.jpgZ-PACK HS3 Connectors | TE Connectivity
Z-PACK HS3 2.5mm Connectors are very high density, two-piece interconnection for applications requiring gigabit data rates, including servers, mass storage, and networking equipment. These connectors are optimized for high speed serial applications. Z-PACK HS3 Connectors support up to 4.8 Gb/s per differential pair, yielding an aggregate of 240 Gb/s per linear card edge inch (25mm). The 6- or 10-row configurations for 60 or 100 high-speed lines per 25mm are compatible with Z-PACK 2mm HM standard and special option modules, providing flexibility on the card edge.
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Z-PACK-Slim-UHD_Connectors_sm.jpgZ-PACK Slim UHD Connectors | TE Connectivity
Z-PACK Slim UHD connector system is a flexible and upgradeable system designed to fit 15 mm (0.6 inch) slot pitch applications and above. The Z-PACK Slim UHD connector has an extremely high contact density combined with excellent high speed signal performance.
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z_pack_sl_thumb.jpgZ-PACK Stripline Connectors SL 100 | TE Connectivity
Z-PACK Stripline 100 connectors have an integral ground plane between each column of contacts to provide the controlled impedance that makes them ideal for high performance systems with edge speeds as fast as 250 picoseconds. Four rows of 0.38 [.015] square posts on 2.54 x 2.54 [.100 x .100] centerlines provide 40 high speed signal lines per inch. No signal lines have to be assigned as ground reference, enabling the connectors to maximize the number of signal lines per unit area.
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Z-PACK-TinMan-85-Ohm-Connector_sm.jpgZ-PACK TinMan 85 Ohm Connectors | TE Connectivity
The new suite of Z-PACK TinMan 85 ohm connectors provides the same industry leading performance and features and benefits designed into the standard 100 ohm Z-PACK TinMan connector system but in an 85 ohm impedance package. This connector was designed to provide 85 ohm nominal characteristic impedance through the entire connector, from PCB footprint to PCB footprint.
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tyco_z-pack_tinman_sm.jpgZ-PACK TinMan High Density Backplane Connectors | TE Connectivity
TE Connectivity’s new Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.
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Z-PACK-TinMan-HD-Orthogonal-Connector-sm.jpgZ-PACK TinMan High Density Orthogonal Connectors | TE ConnectivityThe Z-PACK TinMan Orthogonal connector is one of the latest product extensions to the widely adopted Z-PACK TinMan product family. The Z-PACK TinMan Orthogonal connector has been developed to support perpendicular interconnect solutions with 6 X 12 (72 differential pairs) and 6 X 6 (36 differential pairs) modules. It utilizes the same technology and design approach as the standard Z-PACK TinMan connector. The Z-PACK TinMan Orthogonal connector is engineered for mid-plane applications where high-density and high-performance solutions are desired.
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