The Vishay Semiconductors eSMP® low profile, high performance packages enable higher current density and higher frequency operation utilizing extremely efficient designs with respect to thermal performance, maximum die size capability and low series inductance. Presently available in 3 low profile package designs, the Micro SMP, SMP and SMPC share the similar family traits of low profile, (max. heights of .73, 1.15 and 1.20 mm respectively). Low series inductance, each uses a clip assembly to achieve a very low inductance connection to the top of the die. Finally the package platform provides optimum internal space to support as large a chip as is practically and reliably possible. Augmenting the eSMP® are the SMA FLAT(1.00mm max height), which is a symmetrical low inductance SMD package as well as the very cost effective SMF package (sporting a max. height of 1.08nmm).