Thin Film Networks in SON Packages | BI Technologies
"These SFN Series networks feature one of the smallest PC board footprints per lead count in the industry. Compared to traditional 3-lead SOT23 and 8-lead SOIC packages, the networks offer a 40% and 46% size reduction, respectively," said Mike Torres, BI Technologies' fixed film product manager. "With the small package size and variety of configurations, the networks are ideal for a myriad of applications, including electronic measurement equipment, semiconductor processing equipment, ultrasound equipment, and flight control systems." The SFN Series SON package style is offered in a 6-pad, 2mm square outline with a pad pitch of 0.65mm, as well as an 8-pad, 4mm square outline with a pad pitch of 0.8mm. Custom circuits are available in either package style, while voltage divider circuits are offered in the 6-pad SON package. Isolated and bussed circuit configurations are offered in the 8-pad SON package. Standard SFN Series networks are available with two, four or 7 resistors. Nominal resistance ranges from 10ohm to 100Kohm, with absolute tolerance to +/-0.25% and ratio tolerance to +/-0.05%. TCRs are to +/-25ppm/°C and TCR tracking is to +/-5ppm/°C. BI Technologies will also produce devices outside these specifications to meet specific customer requirements.
Features & Benefits:
- One of the smallest PC board footprints per lead count in the industry
- Networks are housed in surface mount SON (Small Outline, No Lead) packages
- Available in custom, isolated, bussed and voltage divider circuit configurations.
- Nominal resistance ranges from 10ohm to 100Kohm, with absolute tolerance to +/-0.25% and ratio tolerance to +/-0.05%.
Applications:
- Precision analog circuits
- Instrumentation amplifiers
- Precision voltage dividers
- Low noise circuitry
- Ladder networks
- Converter applications.
Additional Information:
