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3M 2mm Latch/Eject Headers

3M 2mm Latch/Eject Headers

3M now offers a 2mm pitch latch/eject header for mating with other IDC connectors. The latch/ejectors maintain a secure connection to the cable assembly during operation, but also allow for easy removal of the harness when needed. To increase the reliability of the system, 3M uses roll pins to attach the latches instead of a snap-in system. This feature helps increase the retention of the latches to the body in high vibration applications and during shipping through the supply chain to the end customer. The latch and body design of this header reduces the probability of the latches breaking when ejecting the mating assembly.

The 3M latch/eject header, 2mm family features 13 available pin counts from 6-50 positions, allowing for design flexibility across applications. The connector bodies feature a cutout to accommodate mating connectors with center bump polarization and are made from PCT resins, allowing for high temperature processing in lead-free environments up to 260℃ (JEDEC J-STD-020C). The family offers RoHS compliant straight and right angle plated through-hole tails for boards up to .125″ thickness. A vertical surface mount tail option is also available in tray or tape and reel packaging with a vacuum cap.

The 3M latch/ejector header, 2mm provides a robust system solution when mated with other 3M wiremount products such as the Series 1522 IDC Sockets and the 2mm Molded Assemblies.

Features & Benefits:

  • 13 available pin counts, ranging from 6-50 positions
  • Latch/eject mechanism maintains a secure connection
  • Roll pins retain latches to body in shipping and high vibration environments
  • Ejector makes removal of assemblies easy
  • Latch design (patent pending) to resist breakage during eject
  • Vertical and right angle through hole tail options for boards up to .125″in thickness
  • Center bump polarization feature
  • High temperature insulators for lead-free processing
  • Robust system solution when used with 3M IDC sockets or molded assemblies

Additional Information:

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