FCI Meg-Array Connector System

The FCI MEG-Array® Board-to-Board Connector System has demonstrated more than 20 years life at the PCB to connector BGA interface in tests conducted in accordance with IPC-SM-785 specification. The high speed, high-density connector system is applicable for use in telecom and datacom applications including, but not limited to, Optics, Memory, Mobile Computing and Desktop Computer Processors.

Scott Kleinle, FCI's MEG-Array® Board-to-Board Connector Product Manager, gave this insight, "The MEG-Array® Connector reliability is confirmed in demonstrating 20 years BGA solder joint life in accordance with IPC-SM-785 test results as well as in meeting Telcordia GR-1217-CORE specification." Kleinle added, "The patented MEG-Array® Connector design results in meeting Telcordia GR-1217-Core and in demonstrating 20 years life."

The standard MEG-Array® Connector offering is available in 100 to 400 positions in stack heights of 4mm to 14mm.

Scott Kleinle, FCI product manager, notes "Our customers want the reliability and performance of the MEG-Array® BGA design, but often in a smaller geometry. We are responding to this need." FCI's MEG-Array® line is currently being used in telecom, datacom, memory and computer applications.

The MEG-Array® Connector System has continually proven its reliability through industry testing. The product's electrical performance has been confirmed in optical transponder applications above 2.5Ghz. In addition, the connector has met Telcordia Specification GR-1217-CORE.

Product Variations/Specifications:

• Options for 4mm to 14mm board-to-board spacing in 2mm increments
• Connector sizes range between 100 and 528 positions
• Meets Telcordia GR-1217-CORE
• Demonstrated solder joint reliability in excess of 22 years per IPC-SM-785
• FCI Connector Performance Specification GS-12-100
• FCI Connector Application Specification GS-20-033