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Z-PACK TinMan High Density Backplane Connectors | TE Connectivity

Part Number Information
Part #:Price/Availability:
19342Buy Now button
19343Buy Now button
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Tyco Electronics Z-PACK TinMan Backplane Connectors

TE Connectivity's Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system. The Z-PACK TinMan connector design follows proven industry backplane convention by offering a fully-protected right angle receptacle for use on daughtercards where handing damage can be a concern when mating to a vertical male header. This connector permits field repairability at either the module or single pin levels.

Ground contacts positioned within each column of the connector, combined with unique lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high throughput performance levels. Reliability is assured with a dual point of contact mating interface and compliant pin interface to the printed circuit board.

Features & Benefits:

  • 10+ Gb/s performance
  • 100 ohm Impedance for differential pair configuration
  • 5 pair module offers 26 pairs/10mm [66 diff. pairs/inch] fitting within a 25.40 [1.00] card slot pitch
  • 4 pair module offers 21 pairs/10mm [53 diff. pairs/inch] fitting within a 20.30 [.800] card slot pitch
  • 3 pair module offers 16 pairs/10mm [40 diff. pairs/inch] fitting within a 16.25 [.625] card slot pitch
  • Right angle pin headers (coplanar) in 3 pair, 4 pair and 5 pair modules
  • Vertical receptacles (parallel board) in 4 pair modules
  • Reliable, redundant contact design on every signal contact
  • Modular system offered in various column modules
  • Meets Industry reliability requirements of Bellcore/Telcordia
  • Sequencing for ground and signal contacts
  • RoHS Compliant

Applications:

  • Switches
  • Servers/Blade Servers
  • Routers
  • Storage

Additional Information: