MarketEye: Printed Circuit Boards in Europe: EIPC Summer Conference

06.22.2009 // Posted by: Walt Custer // Posted in: Articles, Industry Conditions

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This past week I attended and was the keynote speaker at the EIPC (European Institute of Printed Circuits) summer conference in St. Michael, Austria. My charts are included.

The conference, with its many excellent technical papers, was well attended. Below is the program. If a particular paper interests you, e-mail me at walt@custerconsulting.com and I will try to put you in contact with the author.

EIPC Summer Conference St. Michael, June 18 & 19 2009

Thursday June 18

Welcome by the EIPC Chairman Rex Rozario

Keynote: Business Outlook for the Global Electronics Industry, Walt Custer, Custer Consulting Group, USA

Session 1: Business models for PCB success in Europe

• Strategy for survival, part 2, Giacomo Angeloni, SOMACIS, Italy
• How to get business back from China, Michael Weinhold, EIPC,Germany
• A new business model for European PCB producers, Ivan Ho, Topnotch Consulting, Hong Kong

Session 2: Advances in materials Moderator:

• The challenge of using No Flow Prepreg vs. Bonding sheets in Rigid-Flex application, Thomas Michels, TMT Trading + Mark Goodwin, Ventec Suzhou
• Next generation PCB laminate requirements for high speed digital applications, Young Y. Gao, Rogers Corporation, USA
• PTFE composites-designed for excellence in high frequency/ high speed applications, Albert Angstenberger, Taconic, Germany
• Innovative Substrates for PCBs, based on Thermoplastic Polymers, Thomas Apeldorn, Universität, Bayreuth, Germany

Session 3: Advanced enabling technologies

• The Innovative Electronics Manufacturing Research Centre and its PCB Focused Projects, Prof. Martin Goosey, Wolfson School, UK
• 2.5D Technology Platform- A Novel Approach to Rigid-flex and Structural Applications, Markus Leitgeb, AT&S, Austria
• PCBs with Embedded Components, Michael Weinhold, EIPC
• New materials for Flex-/Rigid-flex Circuitry from Sun Chemical, Dr. Karl-Heinz Ognibeni, Sun Chemical, Germany
• Laser applications beyond the limits, Dirk Bäcker, LPKF, Germany
• Advanced routing for next generation of cost effective rigid flex, Stephan Kunz, Schmoll Maschinen, Germany

Session 4: Quality assurance and environmental issues

• Reliability testing for microvias in Printed Wire Boards, Bill Birch, Polar Instruments, Austria
• Developing Raw data into intelligent manufacturing information, Andrew Kelley, X-ACT PCB, UK
• Energy efficient final finishes for PCBs, Dr. Melanie Rischka, Ormecon/ Enthone, Germany
• Energy efficiency in the drill room, Norbert Ferner, Impex Leiterplatten GmbH, Austria

Friday June 19

Session 5: How to improve efficiency in drilling

• Efficiency in drilling, Uwe Lenz, Ernst Lenz Maschinenbau GmbH, Germany
• Advanced Repoint Technology; Reduce Costs without compromising quality, Jason Marsh, Kyocera, USA
• Cost-reduction through innovation- from the viewpoint of a tools supplier, Martin Stumpp, HPTec, Germany

Session 6: How to improve efficiency in drilling

• Influences on drill hole accuracy / quality in PCBs, Stephan Kunz, Schmoll Maschinen, Germany
• One step x-ray drilling/routing process, Pietro Zulli, Pluritec, Italy
• Contract drilling, quality and inspection, Bernhard Steiner, Impex Leiterplatten GmbH, Austria

Site visit Impex Leiterplatten GmbH

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