When you’re building the electronics that defend freedom, the dependability of your supply-chain partners is paramount. That’s why for more than four decades the companies that equip America’s troops have turned to TTI, as have major manufacturers of commercial aircraft, space vehicles and UAVs. These manufacturers know that TTI is a 100 percent authorized distributor of the mil-aero certified, IP&E components that comprise the majority of their circuit board placements. These companies also rely on the fact that TTI has the tools, technology and expertise to ensure they never go line down due to an IP&E component. Call a TTI product specialist at your local TTI branch – 1.800.CALL.TTI
AMP COPALUM Sealed Terminals and Splices are designed especially for solving the inherent problems of terminating aluminum conductors.
The cold applied splice product line is designed at a single component in-line splice to provide high environmental protection to seal the termination from moisture and provide electrical isolation. If moisture is present, it can lead to insulation failure and breakdown of the electrical connection. In this product, sealing is achieved by replacing traditional methods, such as grommets, greases and tapes with a novel TE Connectivity gel technology. The electrical isolation is provided by a polymer outer layer.
TE’s Raychem introduces the new Side Entry Bushing (SEB) product. The SEB product provides a time and money saving solution to customers in the production, re-work and repair of harness assemblies. Pre-coiled side entry reusable silicone bushing designed to be used in high temperature applications where tape or other molded grommets are used. One strip of this Side Entry Bushing replaces as much as 6 feet and 40 wraps of traditional tapes. The material is cross-linked and thermoformed to naturally conform to the tight bundle configuration of its application. The Side Entry Bushing has no adhesive layer so it is easily removed and can be re-used after repairs have been made.
High Contact Density Connectors with High Reliability
A full platform that matches any environment
The design and performances of the 8T connectors meet the most severe requirements set for applications in military and civil aerospace. With the increasing requirement for low profile and EMI shielding, SOURIAU has more than doubled its 8T range.
Designed for durability, better shielding and offering full sealing capabilities!
ARINC 600 Connectors represent a new generation of standardized rack and panel connectors for aircraft applications.
Amphenol now offers a multi-channel circular connector that complies with the ARINC specification. This connector, available in straight plug and wall mount receptacle, uses the ARINC 801 ceramic termini.
Arinc 628 circular plastic connectors offer 2 power (8 amps) and 2 signal (2 amps) contacts with up to 1000,000 mating and un-mating cycles for receptacle. The Arinc 628 series help regulate power in loop circuit with “first mate-last break" contacts designed for airline in-seat power applications.
The ARINC 801 fiber optic terminus is the next generation of butt-joint interconnect technology allowing for higher density multichannel connectors to be achieved.
The TE Connectivity MULTIGIG RT product line is a backplane interconnect family that offers flexibility and customization.
Contura V-Series switches offer an extensive range of aesthetic choices in their contoured rocker actuator styles, surfaces, colors, lens, and legend options.
The Illuminated Plug offers an additional design option for the modular and flexible V-Series Contura system.
Designed and tested to operate flawlessly in the harshest of environments, the MS-Series sealed toggle circuit breaker is ideally suited for COTS (commercial off the shelf ) military applications.
07.12.2016 // Murray Slovick in: Passives
Just like Goldilocks, the market for wireless connectivity products knows when something is just right. And when it comes to getting it right, it’s hard to argue against Bluetooth, with more than 8.2 billion More...
06.16.2016 // Murray Slovick in: Passives
The Design Automation Conference (DAC) is the Electronic Design Automation (EDA) industry’s annual flagship conference. DAC offers education, exhibits and networking opportunities for designers, researchers, More...
05.10.2016 // Murray Slovick in: Passives
If it seems to you that Bluetooth and WiFi, the two most widely used forms of wireless connectivity, have been around for a very long time, well, it’s pretty much true. Back in 1994, Ericsson invented More...
04.14.2016 // Murray Slovick in: Passives
The annual Applied Power Electronics Conference (APEC) and exposition was held at the Long Beach (CA) Convention & Entertainment Center last month. As at the last few APECs, Wide Bandgap (WBG) materials More...
03.24.2016 // Murray Slovick in: Passives
With Easter rapidly approaching it is perhaps appropriate for us to engage in an egg hunt type of game. From time to time our legislators make us play find the prize by tucking important passages into More...
02.12.2016 // Murray Slovick in: Passives
Now in its 21st year, DesignCon is one of the largest annual gatherings of chip, board and systems designers in the country. More...
01.20.2016 // Murray Slovick in: Passives
Automotive systems represent a growing area of opportunity for passives and capacitors in particular. Driver assistance systems, for example, utilize millimeter wave (mmwave) radar at 77GHz for adaptive More...
12.14.2015 // Murray Slovick in: Passives
Bandgap is the term used for the amount of energy needed to release electrons in semiconductor materials so that the electrons can move freely, enabling the flow of electricity. Wide Bandgap (WBG) semiconductors More...
11.12.2015 // Murray Slovick in: Passives
In capacitor research, much effort has been focused on development of high energy density devices. It’s easy to see why. The need for efficient, high-performance materials for electrical energy storage More...
10.21.2015 // Murray Slovick in: Passives
Last year the Pentagon's Defense Advanced Research Projects Agency (DARPA) requested proposals for a 100x100 micron chip (a "dielet") that could be attached to or packaged with an IC to combat counterfeiting. More...