Molex has released a series of through-hole DDR4 sockets that meet JEDEC’s DDR4 specifications with support for high-speed operation and broad applicability in a variety of applications such as servers, workstations and telecommunications products.
DDR4 features key capabilities that support up to three unique module variations across all DIMM form factors. These include *UDIMMs, RDIMMs and LRDIMMs.
Molex’s DDR4 DIMM sockets feature high dimensional stability and excellent compatibility in lead-free and halogen-free technologies. The use of less moisture-sensitive, high-temperature housing material minimizes the incidence of blistering on the connector housing and enables the sockets to withstand high IR or reflow processing temperatures. Reduced yield losses during assembly processes increase customer cost savings.
Molex’s sockets conform to the single-latch-height, 2.40mm seating-plane and one standard contact material for both standard and low-level contact resistance (LLCR) requirements specified by JEDEC. This uniformity eliminates connector variability and compatibility issues prevalent with DDR3.