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Molex C-Grid III Headers and Receptacles

The C-Grid III™ 2.54mm (.100") pitch post and receptacle interconnection system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. C-Grid III is a highly-versatile 2.54mm interconnection system offering unique design features.

Features & Benefits:

  • Surface Treatment
    • C-Grid III is available in 3 standard platings. Two performance levels of selective Gold and one of Tin, all over a Nickel-plated substrate, guarantee the optimum ratio of quality versus cost for your application.
  • Flexibility
    • C-Grid III has been developed to meet the latest industry requirements. Two different termination techniques, solder tail, crimp and insulation displacement, are combined in a complete interconnection system which is based on north/south contact orientation. Headers will accept both discrete wire and ribbon cable connectors.
  • Advantage by Design
    • C-Grid III box contact design employs the same mating concept with all termination techniques. A uniform locking system on all contacts allows full interchangeability inside different housing styles.
  • Interchangeability
    • C-Grid III is fully compatible with the industry standard DIN 41651 as well as the French norm HE-13/14. Moreover, it is fully intermateable/interchangeable with Molex's QF-50 product range.
  • Lower Applied Cost
    • C-Grid III system incorporates a wide range of advanced application tooling, from manually-operated hand tools to semi-automatic harness making machines.
    • C-Grid III offers the widest range of interconnection packaging alternatives in the electronic market today.

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