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Micro Molded Heat-Shrink Shapes | TE Connectivity

Part Number Information
Part #:Price/Availability:
204W201-25-0Buy Now button
203W301-25-G02-0Buy Now button
203W301-25-0Buy Now button
202K111-25-01-0Buy Now button
202A111-25-G07-0Buy Now button
204W221-25-0Buy Now button
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Micro Molded Heat-Shrink Shapes | Tyco Electronics

Connector manufacturers are increasingly offering smaller high performance, rugged, micro circular connectors for use in wiring looms in both civilian and defense markets.

The TE Connectivity range of small heat-shrink molded shapes has evolved in order to cater for these requirements for smaller, lighter-weight products that still offer a great balance of protection properties at the connector-wire interface. Produced in a variety of shapes and materials, TE Connectivity's range of Raychem branded molded shapes are supplied in expanded form. On the application of heat they shrink to a pre-determined size and shape, providing a tough, protective covering for the components over which they are installed.

Features & Benefits:

  • Small size, weight and space saving
  • Supplied in expanded form, facilitates installation
  • Adhesive lined options
  • Strain relief
  • Available in a range of different cross-linked polymeric materials
  • Environmental sealing against fluid and dirt ingression
  • Provides protection against mechanical abuse at the cable connector interface
  • Suitable for a wide range of applications and environmental requirements for low fire hazard, flame retardance, high temperatures and fluid resistant characteristics

Applications:

  • Missiles/Smart Munitions/Missile Defense
  • Global Positioning Systems
  • Satellites, typically used in receivers, transmitters, antennas and cameras
  • Advance Military Aircraft (cockpit electronics)
  • Space Telescopes, Landers & Rovers
  • Geophysical Exploration
  • Hand Held Military Equipment, weapon sights & scopes, helmet mounted systems, night vision goggles and black box applications
  • Medical, Instrumentation and Industrial applications where size and durability are a primary concern