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Murray Slovick Articles

06.16.2016 // Murray Slovick in: Passives

The Design Automation Conference (DAC) is the Electronic Design Automation (EDA) industry’s annual flagship conference. DAC offers education, exhibits and networking opportunities for designers, researchers, More...

05.10.2016 // Murray Slovick in: Passives

If it seems to you that Bluetooth and WiFi, the two most widely used forms of wireless connectivity, have been around for a very long time, well, it’s pretty much true. Back in 1994, Ericsson invented More...

04.14.2016 // Murray Slovick in: Passives

The annual Applied Power Electronics Conference (APEC) and exposition was held at the Long Beach (CA) Convention & Entertainment Center last month. As at the last few APECs, Wide Bandgap (WBG) materials More...

03.24.2016 // Murray Slovick in: Passives

With Easter rapidly approaching it is perhaps appropriate for us to engage in an egg hunt type of game. From time to time our legislators make us play find the prize by tucking important passages into More...

02.12.2016 // Murray Slovick in: Passives

Now in its 21st year, DesignCon is one of the largest annual gatherings of chip, board and systems designers in the country. More...

01.20.2016 // Murray Slovick in: Passives

Automotive systems represent a growing area of opportunity for passives and capacitors in particular. Driver assistance systems, for example, utilize millimeter wave (mmwave) radar at 77GHz for adaptive More...

12.14.2015 // Murray Slovick in: Passives

Bandgap is the term used for the amount of energy needed to release electrons in semiconductor materials so that the electrons can move freely, enabling the flow of electricity. Wide Bandgap (WBG) semiconductors More...

11.12.2015 // Murray Slovick in: Passives

In capacitor research, much effort has been focused on development of high energy density devices. It’s easy to see why. The need for efficient, high-performance materials for electrical energy storage More...

10.21.2015 // Murray Slovick in: Passives

Last year the Pentagon's Defense Advanced Research Projects Agency (DARPA) requested proposals for a 100x100 micron chip (a "dielet") that could be attached to or packaged with an IC to combat counterfeiting. More...

09.14.2015 // Murray Slovick in: New Technology

With 245,000 visitors, 1,645 exhibitors and exhibit floor space totaling 150,000 square meters IFA is one of the world’s leading trade shows for Consumer Electronics and Home Appliances. Organized by More...

08.17.2015 // Murray Slovick in: New Technology

Amid an ongoing tidal wave of mobile phone and portable Internet of Things (IoT) development (such as wearables), designers are being challenged to fit greater functionality into smaller form factors, More...

07.16.2015 // Murray Slovick in: New Technology

Passive and active components traditionally are mounted on the surface of a PC board (PCB). But while component size, ball pitch and line width have been decreasing over the years, in the future it will More...

06.18.2015 // Murray Slovick in: Passives

According to the U.S. Environmental Protection Agency (EPA), the average American household uses about 24 electronic products such as personal computers, mobile phones, televisions, and e-readers. With More...

05.21.2015 // Murray Slovick in: Passives

When you were a kid in school did you ever sit in class when the teacher brought up the subject of a report due the next day—knowing that you had no chance of being able to complete it on time—only to More...

04.22.2015 // Murray Slovick in: Passives

In mid-March the Power Sources Manufacturers Association (PSMA) once again held its annual Applied Power Electronics Conference (APEC), this time in Charlotte, North Carolina, marking the conference’s More...

03.17.2015 // Murray Slovick in: Passives

IEEE’s 2015 International Solid-State Circuits Conference (ISSCC) took place Feb. 22-26 in San Francisco. The theme of ISSCC 2015 was “novel system and circuit solutions which open new vistas for society, More...

02.19.2015 // Murray Slovick in: Passives

Inductors play a fundamental role in the design and development of switch-mode power supplies (SMPS). All three primary SMPS topologies − step-down (buck), step-up (boost), and step-up/down (buck-boost More...

01.21.2015 // Murray Slovick in: Passives

The Internet of Things (IoT) market is set for explosive growth. A projected 30 billion devices will enter into the IoT ecosystem by 2020 according to the market research firm ABI Research. More...

11.20.2014 // Murray Slovick in: Passives

I realized recently, while reading a press release about an AEC-Q200 qualified part, one that met the Automotive Electronics Council requirements for components suitable for harsh automotive environments, More...

10.09.2014 // Murray Slovick in: New Technology

Perhaps the only blemish in the otherwise remarkable and continuing rise of the semiconductor industry—worldwide sales of semiconductors reached $28.4 billion for the month of August 2014, an uptick of More...

Featured Contributor

Murray Slovick

Murray Slovick is Editorial Director of Intelligent TechContent, an editorial services company that produces technical articles, white papers and social media posts for clients in the semiconductor/electronic design industry. Trained as an engineer, he has more than 20 years of experience as chief editor of award-winning publications covering various aspects of consumer electronics and semiconductor technology. He previously was Editorial Director at Hearst Business Media where he was responsible for the online and print content of Electronic Products, among other properties in the U.S. and China. He has also served as Executive Editor at CMP’s eeProductCenter and spent a decade as editor-in-chief of the IEEE flagship publication Spectrum.

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