XCede® High-Performance Backplane Connector

Amphenol ICC
Part Number Information
Part #: Price/Availability:
10114868 Buy Now
10113947 Buy Now
10113949 Buy Now
10114508 Buy Now
10104997 Buy Now
10104999 Buy Now

ICC’s XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. The use of engineering polymers in a resonance-damping shield enables very low crosstalk across a wide frequency range.

XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82.4 differential pairs/inch. A wafer organizer can be used to combine groups of right-angle signal, guidance and power modules as an integrated daughter-card connector.


  • High-speed backplane system capable of 25 Gb/s 
  • Use of engineering materials in the shield aids in reduction of crosstalk resonances 
  • 1.85 mm column pitch offers high linear signal density
    • Configurations with 6 differential pairs/column fit 36 mm card slot pitch and provide 82.4 pairs/inch 
    • 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch 
    • 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch
  • Two ground vias between differential pairs allow elongated antipads to further improve impedance 
  • Optional short compliant pin permits deeper backdrilling and dual diameter vias to enhance return loss performance 
  • Wide ground contacts feature a stiffening rib and are advanced well ahead of signals for exceptional robustness and signal pin protection 
  • Intermateable, electrically and mechanically interchangeable 
  • Licensed second source to Amphenol TCS 



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