The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from ICC. The HPCE® cable assembly incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power distribution applications. HPCE® cable assembly offers low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics make it ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment.