The SFP+ cable assembly’s printed circuit paddle card has been designed to not only address the stringent mechanical interface requirements but also the higher-bandwidth signal integrity requirements for 10Gb/s per channel transmission. It has also been designed to accommodate industry defined EEPROM cable signature requirements and can also accomodate custom applications such as encrypted communication capability via a microcontroller. The cable assembly also includes robust diecast covers and an EMI girdle to assure proper EMI shielding effectiveness and termination. Cable assembly removal is enabled via a user friendly pull tab. In addition, ICC manufactures these cable assemblies using highly controlled and stable cable assembly manufacturing processes that minimize wire management and termination variations that can impact the performance of the cable assembly. Robust final test and quality systems assure high quality cable assemblies conforming to the high-speed electrical performance requirements in industry specifications.