The ICC DensiShield™ I/O system is designed to support the transmission of high speed, serial differential signals while taking customer equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.
The DensiShield™ connector is built around a wafer system employing a differential pair construction where each pair is shielded from the adjacent pair and the adjacent wafer. The 8-pair DensiShield™ connector is ideally suited for 4 bi-directional channels working at >2.5Gb/s. Similar to Infiniband or XAUI links, this connector can also perform at much higher data rates.
Low crosstalk and controlled impedance allow for signals to be transmitted using active equalization devices in the DensiShield™ connectors. This capability will enable the longer cable lengths that are needed to connect racks or cabinets located in separate rooms of the building. The DensiShield™ connector can also be configured to handle low-speed signals and power and is also available in selectively-loaded versions, thereby allowing system designers to benefit from the density and robustness offered by this connector system in I/O applications that do not require high-speed signaling.