ICC TwinMezz™ board-stacking connector brings ultra-high density to mezzanine applications while exhibiting next-generation, high-speed electrical performance. The TwinMezz™ system packs 25 high-speed differential signal pairs in a square centimeter, or 161 signal pairs in a square inch, of board area.
A hermaphroditic design allows the TwinMezz™ connector to mate to itself, significantly reducing the number of part variations needed to accomplish a range of different stack heights. Current plans are to support 6 different connector heights to offer 20 different stack heights in the range of 12mm to 40 mm. Planned options for 2, 4, or 6 differential signal pairs per column will provide capability for circuit counts ranging from 80 to 800 contact positions and to tailor the connector width to fit available board space. The TwinMezz™ connectors exhibit very well-matched impedance, low insertion loss, and low crosstalk, which make them well-suited for applications in very high speed environments.
The open pin field structure, building on the same edge-coupled technology used in ICC's successful AirMax VS® high-speed connector system, allows for custom pin assignments so speed and signal density can be optimized. With optimized wiring patterns, transmission rates of 25 Gb/s or higher are achievable. TwinMezz™ connectors also feature FCI's patented BGA connector termination for easy attachment to printed circuit boards using conventional reflow soldering processes.