The High Density Mezzanine (HD Mezz™) board-to-board connector is designed for computer, networking, telecommunications, storage and general market applications with high pin-count devices on mezzanine or module printed circuit boards (PCBs).
HD Mezz provides many benefits. It allows customers to simplify PCB routing without sacrificing performance, avoid the expense of large complex multi-layer boards and utilize space more efficiently within a given card slot area. Option cards may be added or upgraded to increase flexibility in design, production and testing.
The HD Mezz design has superior electrical and mechanical features that are cost competitive. The design provides a flexible tooling approach that allows for multiple stack heights and circuit size extensions. The unique Molex patented solder charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products.