The High Density Metric (HDM)* connector system is designed for applications that require high interconnect density and high-speed signal integrity. Signal modules of 72 and 144 contacts are available.
Daughtercard modules are combined on a metal stiffener so that they are handled as one connector. Special modules are available for power, guidance, mounting and coding functions. These building blocks can be combined to create very large connectors. Connectors with more than 1,000 circuits are not unusual. The power contacts can handle 15A of current per power blade, efficiently delivering hundreds of watts in multiple voltage levels, even in hot plug applications.
HDMPLUS modules have internal ground contacts that provide a ground reference and isolate contacts from each other nearly all the way through the connector, allowing for either low ground ratios, or subnanosecond rise times. Unshielded modules and shielded modules can be combined as needed on a daughtercard and will all mate with the same simple header on the backplane.
The modularity and design flexibility allow engineers to adapt quickly to changing design requirements or future system upgrades without changing systems.