Murata Micro Electromechanical Systems Sensors incorporate technologies that include wafer bonding and deep reactive ion etching of silicon. These devices ensure exceptional reliability, unprecedented accuracy, and excellent stability over time and temperature. The silicon capacitive sensors are made of single-crystal silicon and glass.
These sensors use a simple and stable capacitive detection principle that is based on the variation of the distance between two surfaces.
The MEMS sensors are robust structures that are very sensitive to inertial forces and pressure but are insensitive to other environmental variables and causes of failure. The capacitance, or charge storage capacity of a pair of surfaces, depends on their distance and the overlapping surface area. The symmetry and other sound design principles of the accelerometers and gyroscopes help to improve stability, linearity, cross-axis sensitivity, and susceptibility to vibrations.