OHMITE PA/PV Series Forged Pin Fin Heatsinks

OHMITE PA/PV Series Forged Pin Fin Heatsinks offer an all-in-one solution combining a compact design with a universal cam clip system for TO-220, TO-247, TO-264 package devices. The PA/PV series forged pin fin heatsinks are designed to be thru-hole soldered to the PCB board that allows forced convection cooling in multiple directions. These heatsinks are ideal for high power and small size (1U or 2U) electronic packaging with natural and forced convection cooling. PA/PV heatsinks are ideal for various applications, including automotive electronics, high-performance transistors, industrial automation, LED lighting, power amplifiers, and voltage regulators.

Features

  • Allows air flow to be entered from multiple directions
  • All-in-One Solution
  • Designed for TO-220, TO-247, TO-264 Package Devices
  • Forged pin construction designed to be thru-hole soldered to the PCB board
  • The pin fin construction produces more surface area than the standard extruded designs

Applications

  • Automotive electronics
  • High power electronics
  • Industrial electronics
  • LED lighting
  • Telecommunication
  • Voltage regulators

Video

This TTI Tech Specs video for Ohmite Forged Fin Pin Heatsinks PA/PV Series explains the Ohmite PA/PV series heatsinks use forged pin construction. The pin fin construction of the PA/PV series produces more surface area than the standard extruded designs. In addition to the increased surface area, the pin fin design also allows airflow to be entered from multiple directions.

See video transcript below

Video Transcript

Heatsinks are great at getting heat out of electronics, but most of them make you force air in one direction or the other. This doesn’t seem like a big deal, but it can be a real frustration for designers. Ohmite’s P series heatsinks use Forged Pin technology in place of traditional extruded fins, and this allows forced convection cooling in multiple directions. P series heatsinks use a universal cam clip system to attach to the device and are thru-hole soldered to the PCB.

Heatsinks are available in single or dual configurations for TO-220, TO-247, and TO-264 packages and are the ideal thermal solution for compact, high power electronics. The pin fin design also provides increased surface area for minimum thermal flow impedance. They’re available with or without a black anodized finish and can be used with natural or forced convection cooling.

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