Fixed Chip Inductors (ELJ-PA)

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The ELJ-PA has low DCR and high current capability, making it suitable for power circuitry. It is also wire wound and resin molded, good for re-flow or flow soldering, has good mounting characteristics and is EU RoHS compliant.


  • Low DCR and large current capability, suitable for power circuitry
  • Wire wound, resin molded chip inductor (PC, PA, PB types)
  • Unique Ceramic Core/Laser-cut technology (PF, PE type)
  • Capable of being Re-flow or flow soldered
  • Wide line-up from 1005 to 4532 case sizes
  • Good for mounting


  • AV equipment
  • Wireless communication equipment
  • General electronic equipment