Sensata HSP Series Thermal Pads provide an efficient alternative to thermal grease, and adhesive on one side. The HSP thermal pads are easy-to-use thermal interface materials designed for use with Standard single-phase and three-phase solid-state relays. These offer thickness of 0.003 for HSP-1,3 and 0.005mm for HSP-2,5,6, and volume resistivity of 102Ω and 1012Ω. Typical applications include automotive electronics, computer components, industrial equipment, LED lighting, power supplies, and telecommunications.