CSD High Density Signal, PCB Connectors

Smiths Interconnect
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High density signal, PCB connectors, 4 contact rows with flex for space applications conform to ESA specification

Features

• Offset-grid contact layout
• Four contact rows within dielectric connector body
• 1.905 mm center-to-center contact spacing in each row and 1.905 row-to-row spacing
• 0.6 mm nominal pin DIA contact size; 42 to 316 contact positions
• Dip solder and SMT soldering contact termination types
• High contact density, low connector weight, lowmating force. High shock and vibration proof (no micro interruptions - test: 2ns)
• Conform to ESA specification.
 

Applications

• Commercial aviation
• Defense
• Space