Conductive Epoxy MLCC (C Series)

TDK
Part Number Information
Part #: Price/Availability:
CGA2 BD 0402 Buy Now
CGA3 AD 0603 Buy Now
CGA4 AD 0805 Buy Now
CGA5 AD 1206 Buy Now
CGA6 AD 1210 Buy Now

TDK’s Conductive Epoxy Series is a conductive glue-mounted device rather than solder-mounted. In high-temperature environments, the connectivity reliability is focused on the solder fillet because there are thermal expansion coefficient differences between the substrate, MLCC, and solder fillet. A conductive glue-mounted device allows for more "flexibility" during periods of expansion and contraction because the thermal expansion differences have been reduced by using a non-solder attachment.Conductive glue is a common method of mounting components in applications that demand reliability at high temperatures, particularly in automotive environments. It's also used in applications that cannot be subjected to the heat of the solder paste mounting process, such as LCD panels, organic EL and LED displays, and CCD devices, which are particularly sensitive to high temperatures.

Features

  • AgPdCu termination for conductive glue mounting
  • Reduce risk of silver migration
  • Improved mechanical/thermal strength when use with conductive glue
  • AEC Q-200 compliant
  • RoHS, WEE, and REACH compliant
     

Applications

  • Engine Sensor Module
  • Organic EL and LED Displays
  • LCD Panel
  • Charge-Coupled Devices
  • Transmission Control
  • Anti-Lock Breaking System
  • Automotive power train
  • Applications requiring a conductive glue mounting method