High Density Connectors Product Family

TE Connectivity


champ_printedcircuit_thumb.jpg0.8 [.031] Printed Circuit Board & Cable Connectors (CHAMP) | TE Connectivity
Wire-to-board EMI shielded high density and low-profile I/O system. Contacts on 0.8mm centerlines provide 30% linear board space savings, and 5.0mm low-profile housings provide approximately 50% reduction in height when compared to other systems.

AMPMUDO-System-50-Tyco-Electronics.jpgAMPMODU System 50 Connectors | TE Connectivity
The AMPMODU System 50 connector family includes a wide variety of high density board-to-board (thru-hole and surface- mount) and cable-to-board connectors. System 50 is composed of one- and two- row receptacles and post headers on .050 x .100 [1.27 x 2.54] spacing between contacts for extreme density and efficient use of printed circuit board area.

sealed040_thumb.jpgAMP PAIR MATE Connectors 040 Series | TE Connectivity
This connector consists of a cap housing that is mounted onto the board horizontally, a plug housing used for wire termination, and receptacle contacts to be loaded into the plug housing.

High-Density-Rectangular-Connectors-Tyco-Electronics.jpgHigh Density Rectangular Connectors | TE Connectivity
High Density Rectangular (HDR) connectors are designed in response to ever-increased demands for miniaturization. The grid spacing of .100 x .100 [2.54 x 2.54] provides the greatest density on the market for a connector accommodating a 20 thru 30 AWG [0.6 thru 0.05 mm²] wire range. A variety of contact configurations and platings permits great design flexibility. Machine terminated, crimp snap-in contacts are available for the entire wire range. Also available are .025 [0.64] square posts on pin and socket contacts suitable for wrap-type wiring.
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MICTOR-Matched-Impedance-Connectors-Tyco-Electronics.jpgMICTOR Connectors (Matched Impedance Connector) .025 | TE Connectivity
Two row plug and receptacle connector with a micro-strip concept of two rows of signal contacts divided by a center power ground plane. Centerline is 0.025 and they are available in 38 through 266 positions. Stack heights range from 6.6mm to 22.86mm.

Z-PACK-2mm-FB-Futurebus.jpgZ-PACK 2mm FB (Futurebus+) Connector System | TE Connectivity
Z-PACK 2mm FB two-piece connector system uses a modular concept and a 2mm contact pitch to provide high-density, high-speed signal and power connections for Futurebus+ and Futurebus+ “like” applications. These versatile connectors are designed to meet the requirements of International Specification IEC 61076-4-104 with applications that include workstations, personal computers, process controllers and telecommunications equipment.

Z-PACK-HS3-Connectors_sm.jpgZ-PACK 2mm HM (Hard Metric) PCB Connectors | TE Connectivity
The AMP Z-PACK 2mm HM Hard Metric connector system is designed to meet the current and future needs of telecommunication, computer and instrumentation applications giving excellent electrical and mechanical characteristics at an economical price. It is a high performance, high density system with flexible configuration which offers upgrade-ability. The connector system is fully supported by TE Connectivity spice models to guarantee choosing the right product to match the application.

tyco_z-pack_tinman_sm.jpgZ-PACK TinMan High Density Backplane Connectors | TE Connectivity
TE Connectivity’s new Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.

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