TE Connectivity High Speed Board-to-Board Connectors
AMP Z-DOK Connectors
The CHAMP Z-DOK Connector system includes two options for system designers. This high speed connector is suitable for use in co-planar docking applications.
IMPACT™ Backplane Connector System
TE Connectivity's new high density IMPACT backplane connector system is now available in two, three and four pair. The new Impact backplane connector system is designed for increased speed and density.
MICTOR Connectors (Matched Impedance Connector)
The MICTOR connector family is based on the microstrip concept of two rows of signal contacts divided by a center power ground plane. MICTOR connectors are motherboard and daughtercard compatible and include designs for cable-to-board applications.
Z-PACK 2mm Hard Metric (HM) Contacts and Accessories
The AMP Z-PACK 2mm HM Hard Metric connector system is designed to meet the current and future needs of telecommunication, computer and instrumentation applications giving excellent electrical and mechanical characteristics at an economical price. It is a high performance, high density system with flexible configuration which offers upgrade-ability. The connector system is fully supported by TE Connectivity spice models to guarantee choosing the right product to match the application.
Z-PACK HS3 Connectors
Z-PACK HS3 2.5mm Connectors are very high density, two-piece interconnection for applications requiring gigabit data rates, including servers, mass storage, and networking equipment. These connectors are optimized for high speed serial applications. Z-PACK HS3 Connectors support up to 4.8 Gb/s per differential pair, yielding an aggregate of 240 Gb/s per linear card edge inch (25mm). The 6- or 10-row configurations for 60 or 100 high-speed lines per 25mm are compatible with Z-PACK 2mm HM standard and special option modules, providing flexibility on the card edge.
Z-PACK HM-Zd Plus Connectors
The Z-PACK HM-Zd Plus connector offers an increase in data rate performance to 15 - 20 Gb/s enabling a performance upgrade to reduce pcb footprint crosstalk, a tighter impedance control, a reduction of intra pair skew and an improvement in the insertion loss characteristics.
Z-PACK Slim UHD Connectors
Z-PACK Slim UHD connector system is a flexible and upgradeable system designed to fit 15 mm (0.6 inch) slot pitch applications and above. The Z-PACK Slim UHD connector has an extremely high contact density combined with excellent high speed signal performance.
Z-PACK TinMan High Density Backplane Connectors
TE Connectivity’s new Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.