<2mm Pitch (Right Angle) Product Family Overview

TE Connectivity


AMPODU-50-50-Connectors-Tyco-Electronics.jpg AMPMODU 50/50 Grid Connectors | TE Connectivity
AMPMODU 50/50 Grid Right-Angle Headers will accommodate a variety of high density packaging applications; right-angle board-to-board applications when mated with vertical receptacles and right-angle cable-to-board applications when mated with cable connectors. The small 1.27 x1.27 [.050 x.050] centerline contact spacing allows efficient use of the PC board area.

AMPMUDO-System-50-Tyco-Electronics.jpg AMPMODU System 50 Connectors | TE Connectivity
The AMPMODU System 50 connector family includes a wide variety of high density board-to-board (thru-hole and surface- mount) and cable-to-board connectors. System 50 is composed of one- and two- row receptacles and post headers on .050 x .100 [1.27 x 2.54] spacing between contacts for extreme density and efficient use of printed circuit board area.

centerline_champ.jpg CHAMP FH Connectors 1.27 [.050] Centerline | TE Connectivity
The FH, or Free Height, connectors are also an all-plastic connector system for internal board-to-board interconnections with a single spring leaf contact design. These connectors may be considered as an alternative to the Series I product line, with the added feature of variable stacking heights. Position sizes available range from 40 to 180 positions in both plug and receptacle for right angle and vertical configurations. A feature unique to the FH system is the closed bottom in the housing, which further inhibits contact contamination from flux and solder during processing.

fine_mate.jpg Fine Mate Connectors | TE Connectivity
0.5/0.8mm FM Connectors are high-density packaging products developed for use in applications where downsizing and higher performance capability are required, such as camcorders and notebook PC's. Consisting of a receptacle assembly and a tab assembly, these connectors represent a new family of board to board connectors with contacts on 0.5mm and 0.8mm centerlines.

0_8-mm-Free-Height-Overview.jpg Free Height Connectors 0.8 mm | TE Connectivity
The 0.8mm FH surface-mount connectors are designed for parallel board stacking applications using subminiature connectors to meet today's electronic industry requirements for high density packaging. It is possible to save more than 50 percent of the required board space when compared to conventional 1.27mm pitch connectors. The FH 0.8mm Pitch Connectors are ideally suited for application downsizing such as PCs (Slim type, notebook, Pen Pad, ect.), cellular telephones, and other electronics requiring miniature connector packaging.

Tyco-Electronics-Impact-Backplane-Connector-System-sm.jpg IMPACT™ Backplane Connector System | TE Connectivity
TE Connectivity's new high density IMPACT backplane connector system is now available in two, three and four pair. The new Impact backplane connector system is designed for increased speed and density.

micromatch_thumb.jpg Micro-MaTch Board-Board & Ribbon-Board Connectors | TE Connectivity
The AMP Micro-MaTch connector family, with its contact spacing of 1.27mm, fully complies with the electronic packaging requirements of today and the future. The system offers a range of board and wire connectors, enabling a variety of wire-to-board and board-to-board interconnections.

micro-strip_connectors.jpg Micro-Strip Connectors | TE Connectivity
AMP Micro-Strip connectors are a high density, controlled impedance connector family compatible with the requirements of high density and high speed data transmission technologies. Each signal line within the mated connector is located at a specific distance from an integral, separable bus bar serving as a ground plane in a micro-strip configuration. The selection of housing dielectric, spacing from signal contact-to-ground plane and conductor geometry provide a specific characteristic impedance plus very low inductance and capacitance.

MICTOR-Matched-Impedance-Connectors-Tyco-Electronics.jpg MICTOR Connectors (Matched Impedance Connector) | TE Connectivity
The MICTOR connector family is based on the microstrip concept of two rows of signal contacts divided by a center power ground plane. MICTOR connectors are motherboard and daughtercard compatible and include designs for cable-to-board applications.

tyco_multibeam_thumb.jpg MULTIGIG RT Connector Products | TE Connectivity
The TE Connectivity MULTIGIG RT product line is a backplane interconnect family that offers flexibility and customization.

0_8-printed-circuit-board.jpg Printed Circuit Board Connectors 0.8 [.031] | TE Connectivity
Right-angle pcb connectors are offered in 36, 50 and 68, and 90 position plugs and receptacles. Printed Circuit Board configurations include thru-hole or hybrid leads. Cable plug connectors are available in 36, 50 and 68 position.

1_25-centerline.jpg Self-Aligning Connectors 1.25 Centerline | TE Connectivity
AMP 1.25mm AF (Alignment Free) Connectors are miniature board-to-board connectors with capability to absorb mis-alignments. Contact pitch is 1.25mm. The connector consists of a plug assembly and a receptacle assembly to mate it. The plug assembly is available in two styles, top-entry and bottom-entry. The top-entry plug accepts the receptacle from above the board and the bottom-entry plug from the back of the board. It is designed with mating force as low as approximately 125 grams per line. It can prevent the board's deflection and make mating operations easy. The mating receptacle can be used in common for both the top-entry and the bottom-entry plugs, making it possible to standardize components and inventory management simpler.

Z-PACK-Slim-UHD_Connectors_sm.jpg Z-PACK Slim UHD Connectors | TE Connectivity
Z-PACK Slim UHD connector system is a flexible and upgradeable system designed to fit 15 mm (0.6 inch) slot pitch applications and above. The Z-PACK Slim UHD connector has an extremely high contact density combined with excellent high speed signal performance.

tyco_z-pack_tinman_sm.jpg Z-PACK TinMan High Density Backplane Connectors | TE Connectivity
TE Connectivity’s new Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.

Additional Information