TE Connectivity PGA LIF Sockets

TE Connectivity Pin Grid Array (PGA) Low Insertion Force (LIF) Sockets are integrated circuit packaging used in most second-through fifth-generation processors. These PGA sockets are screw-machine outer sleeves with either stamped and formed or drawn inner contacts. The sockets are available in customer arrays with more than 1000 positions and are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. PGA sockets find applications in computers and servers.

Features

  • 1.27mm x 2.54mm contact spacing
  • Custom arrays up to 1000+ positions
  • For Intel and custom CPU packages
  • Low insertion force PGA interface to package, through-hole solder attached to PCB
  • Screw machine outer sleeve with stamped and formed, or drawn inner contact

Applications

  • Desktop PCs
  • Notebook PCs
  • Servers

Technical Specifications

Parameters Values
Minimum mechanical life 100 cycles
Maximum insertion force Very Low Force (VLI) 0.7N
Ultra Low Force (ULI) 0.2N
Minimum extraction force Very Low Force (VLI) 0.1N
Ultra Low Force (ULI) 0.05N
Hole size ø0.60mm
Pitch 2.54mm