PQFP Sockets MICRO-PITCH Standard

TE Connectivity
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To simplify the handling and insertion of standard JEDEC plastic quad flat pack (PQFP) ICs, AMP has developed the MICRO-PITCH PQFP Socket.

The socket's two-piece design eases the problems of handling the gullwing-leaded PQFP packages. The IC is first inserted into the plastic cover and then, using the insertion tool, the cover is secured over the socket housing to insert the chip into the socket. The completed assembly presents a low .375 [9.53] profile to permit close stacking of pc boards.

The cover of the MICRO-PITCH PQFP Socket, which is separately available, contains slots that not only protect and separate the leads, but also ensure proper lead-to-contact registration between chip and socket. In addition, the cover provides a rugged cost-effective method of protecting the PQFP IC during shipping, handling and assembly. Visual and mechanical polarization ensures proper orientation of cover and housing during mating, while spring latches in the four corners secure the cover to the housing.  


  • 0.64 [.025] centerline for high density, low cost packaging
  • Low profile permits even higher density packaging with only 9.53 [.375] maximum height pc boards
  • High normal force and positive engagement insures reliable service to minimize field failures


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