The DIPLOMATE Dual Leaf (DL) SIP socket family provides high quality at low cost with superior handling characteristics. Sockets are available in 3- through 30- position sizes with dual wiping contacts in tin and gold plating over beryllium copper or economical tin plated phosphor bronze. The large target area of the contacts and tapered side ramps in the housing insure easy entry of a SIP package. Internal anti-overstress walls prevent contact damage. These stackable housings feature a "true closed bottom" design which prevents solder or flux wicking at class 1 conditions of EIA 486.
Standoffs provide board clearance for proper cleaning after soldering. Sockets are available with retention feature solder tails for self retention in the pc board during handling and flow soldering.
Housings are constructed from self-extinguishing glass-filled polyester, 94 V-0 rated material and meet the material requirements of Table 23.1 of UL 1410 Standard for Television Receivers and Video Products.
The DIPLOMATE DL SIP Socket family meets the requirements of EIA RS415, MIL-S-83734 and the most stringent specifications of main-frame computer manufacturers.