tyco_z-dok_plus_sm.jpgAMP Z-DOK Connectors | TE Connectivity
The CHAMP Z-DOK Connector system includes two options for system designers. This high speed connector is suitable for use in co-planar docking applications.

ampmodu.jpgAMPMODU Interconnect System | TE Connectivity
The AMPMODU interconnect system is based on high-density 0.8mm center-line contacts, and is designed for cable-to board, cable-to-cable, and board-to-board applications. The low profile, high-density design is well suited for applications with tight space constraints. The board mount connectors are available in vertical and right angle styles, and have surface mount leads for IR re-flow processing.

tyco_atca_thumb.jpgATCA Z1 Power Connectors | TE Connectivity
TE Connectivity’ Advanced TCA Power Connector meets and exceeds the PICMG 3.0, R3.0 (Advanced TCA) specification for Zone 1 connector requirements.

tyco_crown_clip_thumb.jpgCROWN CLIP Connectors | TE Connectivity
CROWN CLIP sockets are compact, high-current socket connectors for high current bus bar power distribution.

tyco_crown_edge_thumb.jpgCROWN EDGE Connectors | TE Connectivity
CROWN EDGE Connectors are a board-to-board power interconnect solution that uses ELCON high performance CROWN BAND contact technology configured to mate directly with a printed circuit board edge or, for higher currents, with a solid bus bar. Power, signal and mixed contact modules can be combined and mounted end-to-end to meet the requirements of the applications.

img8931.jpgDocking/Blindmate Connectors Product Family Overview | TE Connectivity

tyco_flatpaq_thumb.jpgFLATPAQ Modular Connectors | TE Connectivity
FLATPAQ connectors provide hot-pluggable AC and DC power in board-to-board applications.

tyco_iccon_thumb.jpgICCON Power Connectors | TE Connectivity
ICCON connectors provide a reliable high current power interconnection with quick connect/disconnect function for space constrained motherboard-daughterboard, cable-board and board-busbar power delivery applications.

minipak_tyco_thumb.jpgMINIPAK HD Power Connectors | TE Connectivity
The MINIPAK HD connector is a two-piece board-to-board connector designed to meet the PICMG MicroTCA specification.

minipak_hde_thumb.jpgMINIPAK HDE Connectors | TE Connectivity
The MINIPAK HDE Connector system is the latest high current power module designed to serve in both backplane power distribution and general pcb-to-pcb applications.

tyco_minipak_thumb.jpgMINIPAK HDL Connectors | TE Connectivity
The new MINIPAK HDL connector combines a high density power interface into a blind-mateable board-to-board connector, which stands only 8mm off the edge of the printed circuit board. TTI now stocks!

tyco_multibeam_thumb.jpgMULTIGIG RT Connector Products | TE Connectivity
The TE Connectivity MULTIGIG RT product line is a backplane interconnect family that offers flexibility and customization.

sec_tyco_thumb.jpgSEC-II Power Connectors | TE Connectivity
The SEC-II Power Connectors offer an ideal combination of low-current and high-current connections in a single, durable design in a variety of combinations of power and signal contacts.

slim_thumb.jpgSlim Universal Power Modules | TE Connectivity
The Slim Universal Power Module (UPM) is a thin printed circuit board mountable power connector.

stedge_tyco_thumb.jpgStandard Edge II Connectors | TE Connectivity
AMP Standard Edge II Connectors provide high reliability and economy in packages compatible with industry standards for double sided printed circuit boards.

img8931.jpgTwo-Piece, High Speed (Right-Angle) Product Family Overview | TE Connectivity

unipowermod_tyco_thumb.jpgUniversal Power Modules (UPM) Connectors | TE Connectivity
Universal Power Modules are designed to complement TE Connectivity 2mm Backplane Connectors, and are offered in both Standard Power (10 Amps per contact) and High Power (16 Amps per contact) delivering up to 100 Amps per linear inch.

tyco_z-pack_tinman_sm.jpgZ-PACK TinMan High Density Backplane Connectors | TE Connectivity
TE Connectivity’s new Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.

Additional Information