Vishay Beyschlag MFU SMD Chip Fuses

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The highly controlled manufacturing thin film process guarantees an outstanding stability of fusing characteristics. The new MFU SMD Chip Fuse series full fill the safety requirements according to UL 248-14 and IEC 60127-4. Both safety standards of the MFU series offer the opportunity to develop only one electronic design for the global market instead of two designs. The MFU series is suitable in applications for the American market (UL) as well as for applications designed for the rest of the world (IEC).

In terms of costs of ownership the MFU series reduces the costs of procurement, logistic, production and spare part supply. The fuses are lead (Pb)-free (category e3), the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of the plating against tin whisker growth has been proven under extensive testing. The MFU Series is full compatibility with the following directives: • 2000/53/EC End of Vehicle life Directive (ELV) • 2000/53/EC Annex II to End of Vehicle Life Directive(ELV II) • 2002/95/EC Restriction of the use of HazardousSubstances Directive (RoHS) • 2002/96/EC Waste Electrical and Electronic EquipmentDirective (WEEE)

Include all sizes 0402, 0603, 0805 and 1206 with current range from 0.5A to 6.3A


• Advanced thin film technology
• Very quick acting fuse characteristics
• Outstanding stability of fusing characteristics
• Standard metric SMD sizes
• Green product, supports lead (Pb)-free soldering


• Information technology
• Telecommunication
• Medical equipment
• Audio/video electronics
• Automotive