Business Outlook for Europe
The EIPC (European printed circuit board trade organization) held its summer meeting in Edinburgh, Scotland on June 9 & 10, 2016.
On Thursday I gave the keynote presentation “Business Outlook for the Global Electronics Industry (with emphasis on Europe)”. My charts and program overview are attached.
Owing to its relatively stable end markets – especially the automotive and instrument and control sectors, Europe is enjoying modest growth in its electronic supply chain this is in contrast to the consumer driven markets (including PCs. smartphones and media tablets) which are primarily produced in SE Asia.
An overview of the full program is given below.
Welcome by EIPC Chairman, Alun Morgan
The global trend in electronics, and its impact to the European electronics and PCB industry, will be illustrated. In addition, a new initiative will be introduced, one that will show European market developments and trends based on industry data.
Session 1: Safety, Quality and Reliability of ML-PCBs
New developments in components, materials and PCB fabrication technology require very advanced test methods depending on market segments. The European Space Agency (ESA) will share their experiences with the control of the supply chain. UL will provide the latest changes in material safety standards as well as their PCB validation service and some new test methods and technologies that have been introduced.
Session 2: Future Technology in components, materials and processes
Electronic components are defining the design and fabrication of electronic devices. The PCB fabrication processes have to meet these changes and the needs of the components that are used to fulfil the end user requirements. The session will show some examples of this from the automotive industry.
Session 3: Latest developments in Final solderable finishes for PCBs
The changes in soldering of components to the printed circuit board have been manifold. On the one hand, the highest First Pass Yield are needed to maintain profitable, whilst on the other the move to lead-free soldering has increased the soldering temperature. Also, the market now demands multiple soldering processes. In this complex field, this session will provide details and trends in solderable finishes and will indicate the limitation of existing technologies and will show opportunities to improve first pass yield.
Session 4: Fabrication experience with advanced technologies
Continuous improvement is part of the PCB fabrication processes, and here Design for Manufacturing (DfM) is very much a part of the on-going process improvement programs. Existing technologies are re-evaluated to improve equipment and fabrication technology for the benefits of the end-user. This session will show some of the trends and improvements opportunities for PCB fabricators, designers and equipment / material suppliers.
For a copy of specific presentations at this conference contact Ms. Kirsten Smit-Westenberg, Executive Director at firstname.lastname@example.org or +31-(0)43-344 08 72.