The EIPC held its winter conference in Lyon, France. EIPC selected Alstom France to host their winter event. Walt Custer presented the keynote: “Business Outlook for the Global Electronics Industry, with Emphasis on Europe.” Walt’s charts (updated with recent data) are attached. The conference program is below.
For information on the EIPC or the individual conference presentations, contact Kirsten Smit-Westenberg, EIPC Executive Director, kwestenberg@eipc.org
EIPC 2018 Winter Conference, Lyon, France, Feb 1 & 2, 2018
“Future Trends for successful positioning of Europe’s place in the Global Supply Chain”
Conference Program Day 1, Thursday February 1
Keynote Session: Business, Technology and New Developments
- Business Outlook: Global Electronics Industry Walt Custer, Custer Consulting Group, USA
- From Semiconductor Die to PCB: Changing Landscapes and Future Requirements Dr. Andrej Ivankovic, Yole Developpement, FR,
- Present and future solutions for the Electronics Industry in Europe, Heinz Gach, AT & S Austria Technologie and Systemtechnik Aktiengesellschaft, AT
Session 1: Trends and capabilities in PCB fabrication
- Future automotive requirements Dr. Christian Klein, Robert Bosch GmbH, DE
- s. mask: solder mask 4.0 Dr. Lothar Weitzel, Würth Elektronik GmbH & Co. KG, DE
- Miniaturized Hermetic Modules for Sensor Integration, Dr. Marc Hauer, Dyconex AG, CH
- ULDk for high speed loss designs, Tamara den Daas-Wijnen, Ventec International Group, NL
- PCB material toolbox for today’s 3 and 4G networks and future high speed needs in 5G in the most cost effective and environmental way, Stig Källman, Ericsson, SE
- 5G design feature driven PCB Technology and Process and presented, Erkko Helminen, TTM,
Session 2: Reliability Moderator: Emma Hudson, UL, UK
- PCB Incoming Inspection and Analysis Speaker tbc
- Defects through Ionic Contamination. Process and finish product control using IEC 61189-5, Graham Naisbitt, Gen3 Systems Ltd, UK
- Reliability of multi-level HDI structures and Reliability of Back-drilling Bill Birch, PWB Interconnect Solutions, CA
- Electronic requirements for global Railway / Trains markets, Thomas Boutaric, Alstom, FR
Tour Alstom
Network Dinner Brasserie Georges Lyon Centre
Conference Program Day 2, Friday February 2
Session 3: Process Improvements
- Future PCB fabrication and material requirements for the global industry segments Grace O’Malley, iNEMI, UK
- Using Raw Data to develop an Intelligent Manufacturing
- Does the Pre-treatment Influence the Layer Characteristics of Organic Surface Preservatives? Rick Nichols, Atotech, DE
- Redefining your solder mask needs with ink jetting Don Monn, Taiyo, US
Coffee break Table Top and Poster Display Area
Session 4: European needs for New Technology, Product Safety and Training
- Safety and reliability Standardization IEC standards and the role of UL in the global market Emma Hudson, UL, UK
- Printed Electronics for Flexible and Conformal Applications Neil Chilton, Printed Electronics, UK
- DuPont Photovoltaic and Advanced Materials for Printed Electronics Joshua Morris, CCI Eurolam, SP
- FED Training Program “Certified Electronics Designer” Christoph Bornhorn + Erika Reel, FED, DE
- 3D printer Dragon Fly for PCB prototyping and electronics
